PROBING DIE ON WAFER FRAMES
There are a number of reasons that you may need to probe a wafer, after it has been diced. In the semiconductor test market, various products such as thin wafers, advanced packages with TSVs, diced wafers, known good die (KGD) application and strip frame devices require frame probing. This creates a range of challenges for conventional probe stations which need to be considered.
Wafer and frame handling
Using wafer handling system to remove traditional wafers from cassettes and load onto a chuck assembly is common practice. The handlers rely on the vacuum pick up from the flat, underside of the wafer. It can then use pre-alignments to detect the flat/notch before positioning on the chuck plate.
When using a dicing frame, these stations are not practical due to the nature of frames and film material. Using the industry standard notch on the frames as a location system, ensures good repeatable position from cassette to the probes’ chuck surface. Fortunately, the uniformity of the frame designs ensure we can use the notch to locate these, just as with the more conventional wafer frame processes.
Download our application note below for more information.
NEED TO FIND OUT MORE?
Contact us and talk to one of our experts