The versatility of our probe stations enables them to be used in a wide range of applications, with a variety of wafer chuck options.

The chuck plate plays an integral part in supporting the wafer throughout processing, not just to accurately position the wafer during testing.

With applications for the semiconductor industry ever diversifying, so are the substrate and materials used to provide new products. Our range of wafer chuck systems have been developed to meet these challenges.

CHUCK OPTIONS

• High voltage (10 KV)
• Wafer frame
• Wide temperature range
• Wafer carriers (double sided probing)
• Single DUT (device under test) probing
• Low current triaxial
• MEMS (Micro-Electro-Mechanical Systems)
• Ceramic substrate
• Photonics
• Variety of finishes, according to application