QUIKLAZE - IMPROVE FAILURE ANALYSIS TO MAXIMIZE YIELD
The QuikLaze laser system is an excellent tool for increased productivity in semiconductor failure analysis, providing a valuable tool for quickly removing passivation materials and cutting circuit lines.
QuikLaze 50ST2 specifically enables quick, easy removal of a variety of materials. Multiple, user-selectable wavelengths provide the capability to selectively remove specific materials while leaving others unaffected.
The system can vastly improve yield for LCD production by quickly repairing defects and removing shorts. The QuikLaze laser system features an Advanced Beam Delivery System (ABDS). The ABDS enables precise cuts on a microscopic level for each of the three wave-length regions (infrared, visible or ultraviolet). The system also provides precise power control of the wavelength selectable beam without sacrificing the beam characteristics.
- Laser head (vertical mount) with 2.5 x 2.5 mm aperture
- XY shutter (standard resolution)
- Close-loop energy control
- 4 m umbilical
- Power supply
- Remote control panel
- Foot switch
- Video spot marker
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