LASER ABLATION – IMPROVE FAILURE ANALYSIS TO MAXIMIZE YIELD
A laser system is an excellent tool for increased productivity in semiconductor failure analysis, providing a valuable tool for quickly removing passivation materials and cutting circuit lines.
A range of system will enables quick, easy removal of a variety of materials. Multiple, user-selectable wavelengths provide the capability to selectively remove specific materials while leaving others unaffected.
The system can vastly improve yield for LCD production by quickly repairing defects and removing shorts. Most systems enables precise cuts on a microscopic level for each of the three wave-length regions (infrared, visible or ultraviolet). They also provides precise power control of the wavelength selectable beam without sacrificing the beam characteristics.
STANDARD CONFIGURATION:
- Laser head (vertical mount) with adjustable aperture
- XY shutter (standard resolution)
- Green, UV & IR configuration options
- Close-loop energy control
- Power supply
- Remote control panel
- Video spot marker
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