Due to the complexities typically associated with high voltage (HV) or high current (HC) devices, wafer-level testing is usually limited to quality or process characterization labs or simple setups that are not integrated into the fab’s standard test floor activities.

Considerations of factors such as instrumentation setup, special cabling, adequate probe station capability and the ability to enable automation and operator safety, means production probing of these devices faces a number of challenges.

Download our application note below for more information.