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Wentworth Laboratories

Wafer Prober and Advanced Cantilever Probe Cards

  • Wafer Probers
    • Analytical Wafer Probers
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Double-Sided Wafer Probers

DOUBLE-SIDED WAFER PROBERS

Our range of double-sided probing systems is designed for wafer sizes up to 200 mm (8″) and is ideal for testing power semiconductor devices such as MOSFETs and IGBTs at wafer level. We offer a choice of fully automatic and semi-automatic double-sided wafer probe stations. Both can be customized to suit a wide range of probing applications.

Pegasus A200D automatic prober

A200D—automatic
double-sided wafer prober

S200D Double sided wafer prober

S200D—semi-automatic
double-sided wafer prober

Probe cards for
double-sided probing

Why use A double-sided wafer prober?

In today’s competitive power semiconductor market maximizing the production of ‘known good die’ is of vital importance.

Double-sided wafer probing provides an accurate and efficient way of fully testing the functionality of more sophisticated and complex power devices at wafer stage. It enables tests which are normally only possible on packaged devices. As a result, it avoids the high cost of re-working power modules, to replace die that do not meet specification for switching speed or RDS(on). At the same time, it also significantly speeds up the production process as well as reducing waste.
Traditionally, using a single-sided wafer prober, it is difficult to accurately measure the switching time or RDS(on) of a power device. This is due to the electrical connection of the tester to the drain or collector via the chuck plate.

S200D Semi-automatic double-sided prober
Double sided prober

How does double-sided probing work?

The main problem with single-sided probing is that the conventional connection method to the chuck introduces a variable inductance electrically in series with the device that is being probed. This can compromise the accuracy of any attempt to make dynamic measurements such as switching speed and RDS(on).

A double-sided probing system allows simultaneous probing of the same die from bottom and top.  By using a probe to electrically connect to the drain or collector, rather than a chuck, the series inductance is effectively removed. This means that the line resistance is constant and can therefore be calibrated out of the test results. Consequently, die that do not meet specification can be identified early during wafer testing.

CASE EXAMPLE—DOUBLE-SIDED WAFER PROBING

Find out how a major power semiconductor manufacturer streamlined their production testing with the help of Wentworth’s A200D double-sided automatic wafer prober.

Requirement

The company used to carry out their wafer testing on a single-sided production prober. However, these tests would only establish to a level of certainty of around 75% that devices were functioning. Additional manual tests were therefore carried out to check a sample of devices by probing the underside of the wafer to ensure the reliability of the initial results. This process was extremely time consuming and – due to its manual nature – error prone. It also meant that not all devices could be tested.

SOLUTION

Introducing the A200D double-sided wafer prober meant that all tests could be carried out at the same time, which eliminated any need for manual testing. This helped to significantly speed up the testing process and increased the accuracy as now all devices on a wafer can be tested. The accuracy and reliability of the new double-sided probing process was successfully confirmed by testing packaged devices.

A200D Double sided automatic prober

NEED TO FIND OUT MORE?

Contact us and talk to one of our experts

CONTACT US

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US Head Office

Wentworth Laboratories, Inc.
1087 Federal Road
Unit 4
Brookfield
CT 06804
USA

Tel: +1 203-775-0448
Email: info@wentworthlabs.com

UK Head Office

Wentworth Laboratories Ltd.
1 Gosforth Close
Sandy
Bedfordshire
SG19 1RB
United Kingdom

Tel: +44 1767 681221
Email: info@wentworthlabs.com

Registered in England, No 1309949
VAT GB 301542902

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