CUSTOM WAFER PROBERS
With over 50 years of experience, our ability to create customized and integrated wafer probing solutions is second to none.
Our extensive range of standard wafer probe stations is designed to be configured to your needs using a wide selection of options and accessories to cover most semiconductor test scenarios.
Where this type of customization is not sufficient for your application, we design bespoke wafer probing solutions to meet your specific requirements at an affordable cost.
We have created bespoke solutions for a wide range of applications including
- High voltage
- Compound semiconductors
- Flexible and printed electronics
- Optoelectronics including VCELs devices and MicroLED
- Customized wafer handling system, including thin/fragile wafers
- Bespoke chuck systems, including interchangeable chucks
- Singulated device testing
- Reverse side illuminated integrating sphere utilizing glass/quartz chucks
CASE EXAMPLE GALLERY
Dual-stage prober with 12" integrating sphere
To test medical imaging devices at wafer stage to identify faulty devices prior to packaging.
A dual-stage prober was designed featuring a 12″ integrating sphere, which can be placed close to the underside of the wafer. This enables probing with vertical probe card technology required for this high end production testing. Find out more
Flying arm prober
Enable the testing of irregular probing geometries on large area devices or panels
Two height sensing probes were added to test along the edges of the large area. These probes are able to move independently from the bespoke XY chuck stage to which they are mounted.
Enable simultaneous probing and sensing of optical devices in a particular orientation without obscuring any part of the device. Opposite sides of each device had to be probed during the process.
A chuck solution with 360° movement was developed which allows for the two opposite sides of each device to be tested, one after the other. This ensured that the detector above the device, which formed an essential part of the test process, was not obscured during any part of the testing.
To measure the deflection angle on MEMS devices
A fully customized optical set-up was provided. This was achieved by sourcing a specialized laser, assembling and configuring the optics and integrating them with the wafer prober. In addition, our designers wrote new software to interface with the laser for full control.
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