Innovative Vertical Probe Card Technology

Wentworth works closely with a select group of technology peers to develop solutions that meet or exceed our customer's requirements for superlative probe card performance.  We've leveraged our expertise in vertical contact technology to develop Accumax, enabling the test of extremely high density flip chip devices under very high current conditions with easy site maintainability; and Micromax, a site maintainable vertical probe card solution for  pre-bump flip chip and aluminum bond pad applications

With numerous patents for innovative probe card design, Wentworth is a recognized leader in vertical probe card technology. The addition of Accumax and Micromax vertical probe cards augments the probe card solutions we have developed for microprocessors, SOC, other advanced logic/ASIC devices, and memory devices such as FLASH and DRAM.

Accumax â
Flip Chip / C4

Cobra â
Array Probe Card

Advanced Cantilever Probe Card Solutions
Wafer and Package Test Solutions

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Accumax, Micromax and Cobra are registered trademarks of Wentworth Laboratories, Inc.

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Micromax â Pre-Bump Flip Chip Devices Aluminum Bond Pads