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Wentworth and Azul joint presentation at Semiconductor Wafer Test Workshop

Wentworth awarded Spansion 'World Class Supplier' for 2006

2008

Wentworth awarded SEMI Award for North America

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Wentworth Accumax Vertical Probe Card Exceeds 11,000 Contacts at 120 Amps for Flip Chip Bumped Logic Devices

Papers / Presentations

Press Releases

Wentworth Introduces Micromax Vertical Probe Card for Pre-Bump Flip Chips and Aluminum Bond Pads

Go to Micromax â vertical probe card for pre-bump flip chips / aluminum bond pads

Accumax, Micromax and Cobra are registered trademarks of Wentworth Laboratories, Inc.

Go to Accumax â vertical probe card product for flip chip devices

Excerpt from Case Study:
"Why Multi-DUT Logic Test is Coming Soon to a Wafer Near You"

"Sourcing from traditional vertical contact technology that would reliably carry the specified current is a diametrically opposing requirement. Why? Cobra â- style vertical probe cards utilize stamped contacts, a contact technology that must attain a certain size to have the bulk to carry higher current. However, to accommodate the finer pitch, they must shrink in size - which then can't carry higher current."

Wentworth Celebrates Its 40th Anniversary

Wentworth Goes Direct in Benelux Region

Wentworth Announces Investment in UK Service Center

Wentworth presents at EMTC, Semicon Europa 2008

Wentworth Accumax case study is the feature article and is on the cover of Advanced Packaging March 2008 issue

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