Micromax

Wentworth Micromax is a vertical probe card for pre-bump flip chip and aluminum bond pad applications. Micromax is an effective alternative to cantilever type probe cards used in wafer test for pre-bump flip chip test, and aluminum bond pad test. Micromax utilizes pointed Saber ä contact technology, which is photo-defined and chemically etched. Pointed Saber contacts easily break through the oxides in aluminum bond pads and pre-bump flip chips, ensuring good electrical continuity.

Micromax Saber contact technology allows for the replacement of individual contacts without major disassembly. Its laminated construction eliminates what is commonly referred to as the 'internal Mylar', thus allowing easy access to individual Saber contacts. This unique feature is exclusive to Wentworth, and it enables our customers to perform on-site repair and maintenance with confidence. Further, Micromax enables the test of multiple devices simultaneously as well as large arrays, without the planarization or alignment maintenance required by cantilever probe cards. These advancements deliver increased reliability, stabiilty and test cell utilization as probe card inventories and the time to maintain cards is reduced.

The powerful design synergy of Saber pointed contact technology in a revolutionary Micromax construction delivers very high performance with easy field maintainabiilty.